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半导体器件导论(英文影印版)

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半导体器件导论(英文影印版)

最 低 价:¥44.90

定 价:¥69.00

作 者:(美)Donald A.Neamen

出 版 社:清华大学出版社

出版时间:2006 年3月

I S B N:7302124515

  • 半导体器件导论
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  • 半导体器件导论
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  • 半导体器件导论
  • 送货上门
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    58.70元
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    内容简介

    本书是美国新墨西哥大学电机与计算机工程系neamen教授所著的“semiconductor physics and devices,3rd edition”一书的改进版本。.
      与原书相比,本书更好地将固体品格结构、量子力学入门知识、固体的量子理论以及半导体物理和半导体器件有机地结合在一起。利用本书,学生只需要具有高等数学和大学普通物理的基础,用一个学期就可以系统地学习到半导体器件的基本理论,从而为进入微电子学研究领域打下一个良好的基础。这一特点也是目前国内出版的同类教材很难达到的。..
      另外,本书还尽量保持了原书的主要优点:
      (1)注重基本概念和方法。本书从内容的整体编排到具体章节的叙述,都体现了突出物理概念、强调基本分析方法的指导思想。书中的数学推导和物理分析融为一体,得出的结论不仅对理解物理概念十分重要,而且经得起反复推敲。书中还采用了大量非常清晰的插图,帮助读者更好地理解基本概念。
      (2)可读性强,便于自学。全书脉络清楚,说理透彻,易于读者理解和掌握。每一章的开头都有引言,告诉读者可以从本章学到什么,应该掌握什么;每一章中都有例题和读者自测题;每一章的最后还有总结、复习提纲和大量习题(其中包含一些采用计算机进行模拟计算的练习题)。通过举例和练习加深读者对基本概念的理解是本书突出的特点。...

    作者简介

    Donald A. Neamen is a professor emeritus in the Department of Electrical and Computer Engineering at the University of New Mexico where he taught for more than 25 years. He received his Ph.D. from the University of New Mexico and then became an electronics engineer at the Solid State Sciences Laboratory at Hanscom Air Force Base. In 1976, he joined the faculty in the ECE department at the University of New Mexico, where he specialized in teachin.. << 查看详细

    目录

    preface.
    chapter 1 the crystal structure of solids
    1.0 preview
    1.1 semiconductor materials
    1.2 types of solids
    1.3 space lattices
    1.4 atomic bonding
    1.5 imperfections and impurities in solids
    ∑1.6 growth of semiconductor materials
    ∑1.7 device fabrication techniques:oxidation
    1.8 summary
    problems
    chapter 2 theory of solids
    2.0 preview
    2.1 principles of quantum mechanics
    2.2 energy quantization and probability concepts
    2.3 energy-band theory
    2.4 density of states function
    2.5 statistical mechanics
    2.6 summary
    .problems
    chapter 3 the semiconductor in equilibrium
    3.0 preview
    3.1 charge carriers in semiconductors
    3.2 dopant atoms and energy levels
    3.3 carrier distributions in the extrinsic semiconductor
    3.4 statistics of donors and acceptors
    3.5 carrier concentrations--effects of doping
    3.6 position of fermi energy level--effects of doping and temperature
    ∑3.7 device fabrication technology: diffusion and ion implantation
    3.8 summary
    problems
    chapter 4 carrier transport and excess carrier
    phenomena 128
    4.0 preview
    4.1 carrier drift
    4.2 carrier diffusion
    4.3 graded impurity distribution
    4.4 carrier generation and recombination
    ∑4.5 the hall effect
    4.6 summary
    problems
    chapter 5 the pn junction and metal-semiconductor contact
    5.0 preview
    5.1 basic structure of the pn junction
    5.2 the pn junction--zero applied bias
    5.3 the pn junction--reverse applied bias
    5.4 metal-semiconductor contact--rectifying junction
    5.5 forward applied bias--an introduction
    ∑5.6 metal-semiconductor ohmic
    ∑5.7 nonuniformly doped pn junctions
    ∑5.8 device fabrication techniques: photolithography, etching, and bonding
    5.9 summary
    problems
    chapter 6 fundamentals of the metal-oxide-semiconductor field-effect transisitor
    6.0 preview
    6.1 the mos field-effect transistor action
    6.2 the two-terminal mos capacitor
    6.3 potential differences in the mos capacitor
    6.4 capacitance-voltage characteristics
    6.5 the basic mosfet operation
    6.6 small-signal equivalent circuit and frequency limitation factors
    ∑6.7 device fabrication techniques
    6.8 summary
    problems
    chapter 7 metal-oxide-semiconductor field-effect transistor: additional concepts
    7.0 preview
    7.1 mosfet scaling
    7.2 nonideal effects
    7.3 threshold voltage modifications
    7.4 additional electrical dharacteristics
    7.5 device fabrication techniques: specialized devices
    7.6 summary..
    problems
    chapter 8 nonequilibrium excess carriers in semiconductors
    8.0 preview
    8.1 carrier generation and recombination
    8.2 analysis of excess carriers
    8.3 ambipolar transport
    8.4 quasi-fermi energy levels
    8.5 excess carrier lifetime
    8.6 surface effects
    8.7 summary
    problems
    chapter 9 the pn junction and schottky diodes
    9.0 preview
    9.1 the pn and schottky barrier junctions revisited
    9.2 the pn junction--ideal current-voltage relationship
    9.3 the schottky barrier junction--ideal current-voltage relationship
    9.4 small-signal model of the pn junction
    9.5 generation-recombination currents
    9.6 junction breakdown
    9.7 charge storage and diode transients
    9.8 summary
    problems
    chapter 10 the bipolar transistor
    10.0 preview
    10.1 the bipolar transistor action
    10.2 minority-carrier distribution
    10.3 low-frequency common-base current gain
    10.4 nonideal effects
    10.5 hybrid-pi equivalent circuit model
    10.6 frequency limitations
    ∑10.7 large-signal switching
    ∑10.8 device fabrication techniques
    10.9 summary
    problems
    chapter 11 additional semiconductor devices and device concepts
    11.0 preview
    11.1 the junction field-effect transistor
    11.2 heterojunctions
    11.3 the thyristor
    11.4 additional mosfet concepts
    11.5 microelectromechanical systems (mems)
    11.6 summary
    problems
    chapter 12 optical devices
    12.0 preview
    12.1 optical absorption
    12.2 solar cells
    12.3 photodetectors
    12.4 light-emitting diodes
    12.5 laser diodes
    12.6 summary
    problems
    appendix a selected list of symbols
    appendix b system of units, conversion factors, and general constants
    appendix c unit of energy—the electron-volt
    appendix d “derivation”and applications of schrodinger's wave equation
    index...

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